| 摘要 |
PURPOSE:To prevent generation of a short-circuit between leads at the time of dew condensation by a method wherein the material, having the boundary of the inner and the outer lead parts and the necessary region on both sides which are coated by insulating resin, is used as a lead pin. CONSTITUTION:A polyimide resin coated layer 7' covering the prescribed region located on both sides of the boundary of an inner lead 51 and an outer lead 52 is formed on each lead pin in advance. As a result, a semiconductor device having much better workability than the conventional device formed by performing a resin coating method after mounting, can be manufactured. Accordingly, the short-circuit generating between leads when the semiconductor device is used at the time of dew condensation can be prevented. |
