发明名称 MOLD THICKNESS CONTROL DEVICE OF MOLD CLAMPING MECHANISM
摘要 PURPOSE:To constitute the titled device that a thickness can be grasped accurately at every mold thickness and operation can be performed swiftly and safely, by a method wherein the device is turned over a mold clamping ram by a gear formed unitarily on a trunk part and a driving gear born by a holding component and advance and backward movements are performed along with a mold clamping plate. CONSTITUTION:In a mold thickness control device, a connecting component 10 is moved on a mold clamping ram 6 while the same is being revolved by turning of a worm gear 15. According to the above, the mold clamping plate 4 also is moved and a distance between the same and a clamp plate 2 is varied. A quantity of movement of the mold clamping plate 4 can be read out by a scale 8. Clamping or release of the connecting component 10 to the mold clamping plate 4 can be performed easily by only turning a clamping component 13 through handle operation, the mold clamping ram 6 and the connecting component 10 after clamping are unified structurally and mold clamping force to be generated by a mold clamping cylinder 5 is transmitted to the center part of the mold clamping plate 4 by the mold clamping cylinder 5 without having wastefulness. As a position of the mold clamping plate can be controlled freely in this manner, mold thickness control can be performed accurately in a short period of time.
申请公布号 JPS61158418(A) 申请公布日期 1986.07.18
申请号 JP19840279153 申请日期 1984.12.29
申请人 AOKI SEISAKUSHO:KK 发明人 AOKI KATASHI
分类号 B22D17/26;B29C45/17;B29C45/64 主分类号 B22D17/26
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