| 摘要 |
PURPOSE:To enhance crack resistance relatively, by bending the peripheral part of a mounting part in the thicker direction of the thickness of the resin of a package, thereby alleviating stress, which is concentrated at the specified part of a semiconductor-chip mounting part. CONSTITUTION:In a device 10, a peripheral part 14 of a chip mounting part 13a is bent in the thicker direction of a resin forming a package. A thickness t4 from a tip 14a of the bent peripheral part 14 to a surface 11a of the resin 11 and a thickness t5 from the tip 14b to a back surface 11b are approximately equal. Therefore, the effective thickness from the tip 14b of the peripheral part 14, where stress due to water vapor is concentrated and cracks are liable to occur, to the back surface 11b is increased from t1 to t5. However, a thickness from a starting part 14c of the bending at the peripheral part 14 to the back surface 11b of the package is still t1. The angle at the part 14c forms an obtuse angle already. Therefore, stress concentration is weakened, and a crack, which runs to the back surface 11b of the package from the part 14c, is not yielded. |
