发明名称 PACKAGE FOR SEMICONDUCTOR IC
摘要 The casing and inserting in storage magazine comprising a body 3 is provided with a surface 2a which is arranged to be printed, the surface having projections 1a at its edges to prevent the still wet printing ink from being rubbed off by the internal wall of a magazine (5, Figure 3) in which the component is immediately accommodated. The projections can be elongate, as shown, or can comprise four corner projections (1b, Figure 2). Alternatively the surface 2a may be concave between its edge regions. <IMAGE>
申请公布号 JPS61194853(A) 申请公布日期 1986.08.29
申请号 JP19860035400 申请日期 1986.02.21
申请人 TELEFUNKEN ELECTRONIC GMBH 发明人 FURITSUTSU KIIRUBUAIN
分类号 H01L23/04;H01L23/00;H01L23/544;H05K13/00 主分类号 H01L23/04
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