| 摘要 |
PURPOSE:To improve heat radiation effect of a semiconductor device itself by providing radiation plates at the positions where the distance between a tab and a package becomes minimum solidly with the tab. CONSTITUTION:A length A of tab 1 is the maximum to the other length B (A>B). Therefore, if a package is square, the distance between an external circumference of the tab 1 and an external circumference of the package becomes minimum in the direction of the length A. Short tab supporting leads 22 and 23 are provided along the length A and utilized as radiation plates. With this constitution, heat radiation effect of the semiconductor device itself is improved. |
