发明名称 SOLDER TREATING EQUIPMENT
摘要 PURPOSE:To perform efficiently and surely the cleaning and drying by a through automatic treatment by constituting of the solder dipping part of rotary type and the cleaning and drying part of rotary type having cleaning mechanism and drying mechanism. CONSTITUTION:The solder dipping part 1 has the structure of rotary type, receives at a receiving part 4 the electronic component fed from the feeding part 3 and clamps it by the clamping part 5. A flux is then coated by the flux coating part 6, the flux is removed from the lead by the flux removing part 7, the lead is heated by the preheating part 8 and the solder is dipped in the solder tank 9. It is then cleaned by three precleaning tanks 11-13 and delivered to the cleaning and drying part 2 via the delivery part 14. The cleaning and drying part 2 is of rotary part as well and the receiving part 19 receives the electronic component via the transfer part 18 from the solder dipping part 1, cleans in order in the cleaning tanks 20-23, dries with hot air at the drying part 25 via the water cutting mechanism 24 and releases from the releasing part 26 to the storing part 27.
申请公布号 JPS61235070(A) 申请公布日期 1986.10.20
申请号 JP19850076114 申请日期 1985.04.10
申请人 IDEYA:KK 发明人 INAGAKI KATSUICHI
分类号 B23K1/00;B23K1/08;H01L23/50;H05K3/34 主分类号 B23K1/00
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