| 摘要 |
PURPOSE:To improve the packing density per single device, by packing plural pieces of memory elements in one package and, at the same time, limiting the number of simultaneously operating memory elements to one. CONSTITUTION:Four pieces of semiconductor memory elements 2a-2d are packed in one package and each data line RD and WD are commonly connected with them. Since the chip selecting terminals CE1-CE4 and R/W controlling terminals R/W1-R/W4 of the semiconductor memories 2a-2d are individually provided, such high-density packing is possible because only a heat value equal to one piece of semiconductor memory element is produced even if the plural memory elements are packed in one package, when the memory elements are controlled so that only one memory element can operate simultaneously. |
