| 摘要 |
PURPOSE:To accurately control an insulating distance by using a lead frame in which a substrate support and a tie bar are bonded at the portion of a support securing fine wirings, melting an adhesive after molding with resin, and separating the tie bar. CONSTITUTION:A semiconductor element 1 is placed on a substrate support 2, and the element and the leads are wired. Then, external leads 4 and a portion removed from the bonded part 6 of a support securing fine strips 5 are held by a mold, and molded with resin. Then, a tie bar 8 is heated to melt the adhesive of the part 6, and the second part 12 which includes the fine strips of commonly connecting fine strips is separated. |
