| 摘要 |
PURPOSE:The titled thermosetting one-pack type composition, containing a liquid epoxy resin, latent curing agent and a specific amount of fused silica and having high reliability in heat cycle tests when sealing semiconductor element mounted on a ceramics substrate. CONSTITUTION:A resin composition containing (A) a liquid epoxy resin, e.g. epichlorohydrin bisphenol A type epoxy resin, (B) a latent curing agent, e.g. 2,4-dihydrazino-6-methylamino-s-triazine and, (C) 55-65wt% fused silica, preferably having 10-100mum average particle diameter. |
