| 摘要 |
PROBLEM TO BE SOLVED: To provide a highly reliable light-emitting device in which bonding strength of a semiconductor element does not deteriorate even when an organic component is deposited on a lead frame.SOLUTION: A light-emitting device 100 comprises: a molded member 10 containing a resin; one or more lead frames 22 arranged inside the molded member 10; and a light-emitting element 50 mounted on the lead frames 22 or the molded member 10. At least one of the lead frames 22 has a protrusion 22a. The periphery of the protrusion 22a is surrounded by the molded member 10, and the upper surface of the protrusion 22a is exposed from the molded member 10. A semiconductor element 60 is mounted on the upper surface of the protrusion 22a via a bonding member 62 containing a resin. The bonding member 62 is arranged so as to straddle the lead frames 22 and the molded member 10. |
