| 摘要 |
<p>A method of assembling a surface-mounted component (5) onto a substrate, such as a printed circuit board, comprising applying a deposit of solder cream to the substrate, preheating to boil off volatile material from the solder cream, and securing the component to the substrate prior to a reflow stage to solder the component to the substrate, in which adhesive is applied to the component (5) through cut-outs (7) by a device (9) prior to its location on the substrate by a transfer device (8). The application of the adhesive to the component, rather than to the board, cuts out a step in the processing of the substrate. The component is supplied as part of a stream of such components by a carrying medium (1, 2, 3) which has the cut-outs (7) beneath part of the component (5). The carrying medium may be a composite paper tape consisting of three layers (1, 2, 3), a flexible multiple blister pack consisting of two layers (1, 10) [Figure 8], each of which has multiple cut-outs (7), or a magazine having a single cut-out. When the components (5) are placed on the printed circuit board in their assigned position the adhesive achieves a secure mechanical bond between the board and the components thus preventing the components from moving, lifting or being blown off during the course of the reflow operation when components are fused by molten solder to the printed circuit board. <IMAGE></p> |
