发明名称 METHOD OF GROWING INGAASP ON INP SUBSTRATE WITH CORRUGATION
摘要 A method of growing an InGaAsP layer on a corrugated InP substrate as a part of a procedure for producing a DFB semiconductor laser includes the step of heating the substrate up to temperatures approaching 700 DEG C. while holding the substrate in an atmosphere which contains arsine and phosphine. The substrate is subsequently moved to InGaAsP and InP growth chambers for growth of these respective layers. The method of the invention is advantageous in that the corrugated structure of the substrate is maintained intact throughout the procedure.
申请公布号 GB2146259(B) 申请公布日期 1987.02.04
申请号 GB19840019247 申请日期 1984.07.27
申请人 * NEC CORPORATION 发明人 TOMOO * YANASE;IKUO * MITO
分类号 C30B19/12;C30B25/02;C30B25/12;C30B25/18;H01L21/20;H01L21/205;H01L21/208;H01S5/00;H01S5/12;H01S5/323;(IPC1-7):C30B23/00;C30B19/00;C30B23/02 主分类号 C30B19/12
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