| 发明名称 |
DRY FILM SOLDER MASK COMPOSITE LAMINATE MATERIALS |
| 摘要 |
In an example, a dry film solder mask (DFSM) composite laminate material is disclosed. The DFSM composite laminate material includes a printed circuit board (PCB) laminate material, a cyclic compound chemically bonded to the PCB laminate material, and a DFSM material. The DFSM material is reversibly bonded to the PCB laminate material via the cyclic compound. |
| 申请公布号 |
US2016338196(A1) |
申请公布日期 |
2016.11.17 |
| 申请号 |
US201514735395 |
申请日期 |
2015.06.10 |
| 申请人 |
International Business Machines Corporation |
发明人 |
Czaplewski Sarah K.;Kuczynski Joseph;Wertz Jason T.;Zhang Jing |
| 分类号 |
H05K1/09;H05K1/03;H05K1/02 |
主分类号 |
H05K1/09 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A dry film solder mask (DFSM) composite laminate material comprising:
a printed circuit board (PCB) laminate material; a cyclic compound chemically bonded to the PCB laminate material; and a dry film solder mask (DFSM) material, wherein the DFSM material is reversibly bonded to the PCB laminate material via the cyclic compound. |
| 地址 |
Armonk NY US |
