| 摘要 |
PURPOSE:To instantaneously laser bond a semiconductor element by shielding laser light which is led to an optical fiber, and also providing a vacuum adsorbing means on a supporting body of the optical fiber, or the like. CONSTITUTION:An exhaust is executed from an exhaust port 122 of the first supporting body 21, and a semiconductor element 1 is sucked to a vacuum sucking nozzle 120 through an exhaust hole 123. Subsequently, a laser die bonding tool is made to descend and the semiconductor element 1 and a heat sink 2 are made to contact through solder 104. When a load which has been set to a load regulator is applied to the semiconductor element 1, a shielding plate 125 contacts the solder 104. At this point, when a laser light is emitted through an optical fiber wire 61, the solder 104 of the heat sink 2 is melted. When the laser light is stopped, the solder 104 is solidified, and the semiconductor element 1 does not strike directly against the laser light but is fixed to the heat sink 2 by the solder 104. According to this mechanism, the bonding time can be shortened. |
