| 摘要 |
PURPOSE:The titled composition that contains an epoxy resin, a polyfunctional phenolic resin, a triazole or indazole derivative and a curing accelerator, thus showing high adhesion to metal and good drilling processability, when it is used as a material for printed circuit boards. CONSTITUTION:The objective composition contains, as essential components (A) an epoxy resin such as bisphenol A type epoxy resin, (B) a polyfunctional resin, such as bisphenol A novolac resin, (C) a triazole such as a compound of formulas I-IV (R1-R12 are H, methyl, phenyl, hydroxyl, amino) or an indazole and (D) a curing accelerator, preferably an imidazole bearing a masked imino group. The amount of component B corresponds to 0.5-1.5 equivalent of phenolic hydroxyls based on the epoxy groups, component C is 0.1-10pts.wt. per 100pts.wt. of resin A and component D is 0.01-5pts.wt. per 100pts.wt. of resin A.
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