发明名称 THERMOSETTING RESIN COMPOSITION, LAMINATE USING SAME AND PRODUCTION THEREOF
摘要 PURPOSE:The titled composition suitable for multilayer printed circuit board, having improved flame retardance, heat resistance and electrical characteristics, comprising a specific prepolymer consisting of a poly(p-hydroxystyrene)derivative and a prepolymer consisting of a specific compound as essential components. CONSTITUTION:(A) A prepolymer consisting of a poly(p-hydroxystyrene) derivative shown by formula I (A is H, alkyl, etc.,; R is 2-4C alkenyl or alkenoyl; m is 1-4; n is 1-100) is blended with (B) a compound (e.g., triallyl isocyanurate, etc.,) shown by formula II, formula III or formula IV (R1-R7 are 2-4C alkenyl or alkenoyl; m' is 2-3) in a weight ratio of 90:10-10:90, preferably 70:30-30:70, dissolved in an organic solvent, impregnated into a substrate and dried to give prepreg, which is laminated and bonded.
申请公布号 JPS62161847(A) 申请公布日期 1987.07.17
申请号 JP19860002092 申请日期 1986.01.10
申请人 HITACHI LTD 发明人 NAGAI AKIRA;KATAGIRI JUNICHI;TAWARA KEIKO;TAKAHASHI AKIO;WAJIMA MOTOYO;NARAHARA TOSHIKAZU
分类号 C08L25/18;C08L25/00;H05K1/00;H05K1/03 主分类号 C08L25/18
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