| 摘要 |
PROBLEM TO BE SOLVED: To provide an adhesive composition that can sufficiently be cured by a reflow process and has excellent impact resistance, sufficient self alignment and sufficient storage stability.SOLUTION: The adhesive composition is an adhesive composition for reinforcing the bonding of an electronic component with a mounting board by a solder ball and comprises (A) an epoxy resin and (B) an aromatic amine having a melting point of 150°C or higher and having, in an aromatic ring having an amino group, two or more substituent groups including the amino group. The substituent group of the aromatic ring in the component (B) is at least one kind of group selected from the group consisting of an amino group, a hydroxyl group, a carboxyl group, a substituted or unsubstituted alkyl group, a substituted or unsubstituted aryl group, a substituted or unsubstituted alkylene group, a substituted or unsubstituted oxyalkylene group, a substituted or unsubstituted oxyarylene group and a sulfonyl group.SELECTED DRAWING: None |
