| 摘要 |
PURPOSE:To make it possible to check contact resistance and polish a needle point in the course of measurement of characteristics and thereby to improve operability, by forming an element piece for checking contact resistance and an element piece for polishing the needle point in arbitrary places of a semiconductor wafer wherein a large number of semiconductor elements are formed. CONSTITUTION:At a point of time reached when ordinary characteristic measurement is performed in a prescribed number of times for each of elements 1 or when imperfection is found successively, a needle 5 is moved first to an element piece 10 for checking contact resistance so as to be measured with respect to the contact resistance, and thereby it is determined whether a state of contact is good or bad. When the state of contact is determined as good on the occasion, the ordinary characteristic measurement is continued. When it is determined as bad, the needle 5 is moved subsequently to an element piece 11 for polishing a needle point so as for the fore end of the needle 5 to be polished. Then, the state of contact is determined again, and thereafter a return is made to the ordinary characteristic measurement.
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