| 摘要 |
PURPOSE:To enable a thin and uniform resist film to be formed, by dipping a diluted resist on a wafer and applying mechanical vibration in the direct- parallel to the wafer surface to thinly extend the resist all over the surface of the wafer and then lowering internal pressure of the container to dry the resist. CONSTITUTION:A diluted resist of about 1cc is dipped on a wafer 1 by using a resist-quantitative supply device 3. The resist is extended all over the surface of the wafer 1 by operating a vibration device 5 comprising a magnetic strain element. Since the wafer 1 does not revolve then, a part of the dipped resist does not disperse. After full extension of the resist, a vacuum pump 6 is operated to lower the internal pressure in the vacuum container 2 of a resist coating device so that the solvent is evaporated to solidify the resist. Hence, the uniform resist film desirably thick can be formed without resist loss.
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