| 摘要 |
An IC carrier assembly comprises a substrate (12) having an aperture (22) and an associated conductor pattern (63). The conductor pattern (63) defines a number of conductors overlying the aperture (22). An IC element (11) is bonded to all the overlying conductors (65) via respective contacts to form the assembly. The contacts of the IC element which are bonded to the conductors and the conductors themselves are substantially symmetrically arranged about a line of symmetry (25). |
