| 摘要 |
PURPOSE:To improve the reliability of the glass sleeve type semiconductor device by setting the hardness of the electrode film at a suitable value and adequately providing the pressing pressure to a semiconductor chip. CONSTITUTION:In the glass sleeve type semiconductor device having a semiconductor chip 1 formed of a semiconductor 6 having a P-N junction, a metallic electrode 5 formed at least on one main surface and other metallic electrode film 7, a pair of external lead electrodes 2 provided at both ends of the chip 1, lead wires 4 integrally welded to the electrodes 2, and a glass sleeve 3 fused around the electrode 2, the Vickers hardness of the metallic electrodes on the chip 6 is set at 20-50. Thus, it prevents the trouble due to the thermal expansion coefficient difference between the chip and the sleeve, and improves the reliability of the device without modifying the conventional manufacturing method. |
