Fully integrated thermoelectric devices and their application to aerospace de-icing systems

摘要

A thermoelectric module and methods for making and applying same provide an integrated, layered structure comprising first and second, thermally conductive, surface volumes, each in thermal communication with a separate respective first and second electrically conductive patterned trace layers, and an array of n-type and p-type semiconducting elements embedded in amorphous silica dielectric and electrically connected between the first and second patterned trace layers forming a thermoelectric circuit.

主权项

1. A microelectronic circuit module comprising:
a heat producing semiconductor chip mounted on a packaging element that has micro-channels through which a working fluid is passed to collect and transfer heat from the semiconductor chip; a thermoelectric module comprising a network of micro-channels embedded within silica dielectric through which the heated working fluid is circulated; and a first thermally isolated thermoelectric circuit embedded within silica dielectric that consists of a linear array of MAX-phase electrodes interleaved between alternating n-type and p-type semiconducting elements, wherein the MAX-phase electrodes contain micro-channels through which the working fluid is circulated and progressively cooled.