| 摘要 |
PURPOSE:A resin composition, containing a specific copolymer and a monomer copolymerizable therewith in a specific composition, having improved curability, capable of giving cured articles having excellent mechanical properties as well as electrical characteristic and suitable for molding materials, coating materials and adhesives. CONSTITUTION:A resin composition containing (A) 80-20pts.wt. copolymer having carbon-carbon unsaturated bonds in the side chain, e.g. a reaction product of a compound expressed by formula I such as 2-hydroxyethyl acrylate, etc., with a monomer copolymerizable therewith and a compound expressed by formula II (X is OH, amino, epoxy, etc.; Y is OH, amino, epoxy, etc.; R1, R2, R6 and R7 are H, 1-12C alkyl, etc.; R4 and R5 are 1-12C alkylene, etc.; R3 and R8 are X or Y), etc., and (B) 20-80pts.wt. monomer copolymerizable with the component (A).
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