| 摘要 |
PURPOSE:To obtain cooling structure having low thermal resistance and high reliability and containing no vibration system easily by thinning the thickness of a fine gap between a screw bar and a chip oppositely faced to the screw bar. CONSTITUTION:Integrated circuit chips 2 are soldered to a substrate 1, the surface of the substrate 1 is covered with thin-films having width equal to fine gaps 5, a substrate holding frame 8 and a cooling-plate bottom plate 9 and a cooling-plate side frame 10 from which a cover 11 on a cooling plate is removed are fixed, screw bars 4 are screwed into tapped holes in the cooling-plate bottom plate 9, and brought into contact with the thin-films covered onto the surfaces of the integrated circuit chips 2, washers 7 are entered and nuts 6 are clamped to fasten the screw bars 4 to the cooling-plate bottom plate 9, and the cover 11 on the cooling plate is fixed to the cooling-plate side frame 10, keeping airtightness. The cooling-plate bottom plate 9, the cooling-plate side frame 10, the cover 11 on the cooling plate and the substrate holding frame 8 are separated, the thin-films covered onto the integrated circuit chips 2 are removed, and the substrate holding frame 8 and a cooling section 12 are assembled again. Accordingly, the fine gaps 5 having width equal to the thin- films are formed among the integrated circuit chips 2 and the screw bars 4.
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