| 摘要 |
PURPOSE:To prevent the warping of a semiconductor chip, by providing a thin semi-insulating layer and a metal layer having excellent heat conductivity between a buffer layer and a semi-insulating substrate, and decreasing thermal resistance. CONSTITUTION:A thin semi-insulating layer 3' and a metal layer 4, which is connected to a PHS metal layer, are provided between a buffer layer 2 and a semi-insulating substrate 3. Heat, which is yielded at an active layer 1, reaches the metal layer 4 through the buffer layer 2 and the insulating layer 3'. Since the heat conductivity of the metal layer 4 is excellent, the most part of the heat is transferred to the PHS metal layer 5 on the side surface of a semiconductor chip through the metal layer 4. Since the insulating layer 3' is thinner than the substrate 3, heat resistance is reduced as a result. Thus, the warping of the semiconductor chip is prevented.
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