| 摘要 |
PURPOSE:To obtain a reliable semiconductor, by cleaning the surface of a Cu based lead of a sealed semiconductor, activating the surface, and applying noncorrosive organic flux. CONSTITUTION:In a semiconductor, which is sealed by using a Cu based lead material, a lead part, which is protruded from a sealed part, is cleaned. Thereafter, a flux film having a thickness of 1-50 mum is formed on the lead part. As the Cu based lead, lead wire is included in addition to a lead frame, which is molded by pressing or etching a plate strip made of Cu alloy such as Cu-Sn, Cu-Fe, Cu-Sn-Cr and Cu-Ni and pure copper. Thus a reliable semiconductor is obtained. |
