发明名称 Semiconductor light emitting element and light emitting device
摘要 A semiconductor light emitting element includes: an n-type cladding layer containing n-type impurities (Si); a light emitting layer laminated on the n-type cladding layer; and a semiconductor layer containing a p-type cladding layer containing p-type impurities (Mg) and laminated on the light emitting layer. The light emitting layer has a multiple quantum well structure including first to fifth barrier layers and first to fourth well layers, and one well layer is sandwiched by two barrier layers. The thickness of the p-type cladding layer 161 is set at less than 3-times the thickness of each of the first to fourth well layer.
申请公布号 US9496459(B2) 申请公布日期 2016.11.15
申请号 US201314051100 申请日期 2013.10.10
申请人 TOYODA GOSEI CO., LTD. 发明人 Kusunoki Katsuki;Sato Hisao
分类号 H01L29/15;H01L33/32;H01L33/06 主分类号 H01L29/15
代理机构 Sughrue Mion, PLLC 代理人 Sughrue Mion, PLLC
主权项 1. A semiconductor light emitting element comprising: an n-type semiconductor layer that is composed of a group III nitride semiconductor doped with an n-type impurity; a light emitting layer that is laminated on the n-type semiconductor layer, composed of a group III nitride semiconductor, and emits light having a wavelength of not less than 500 nm and not more than 570 nm by passing a current; and a p-type semiconductor layer that is laminated on the light emitting layer, composed of a group III nitride semiconductor doped with a p-type impurity, and has a confinement layer used for confining carriers within the light emitting layer, wherein the light emitting layer comprises: at least four well layers that are composed of a group III nitride semiconductor; andat least five barrier layers that are composed of a group III nitride semiconductor whose band gap is larger than a band gap of the group III nitride semiconductor of the well layers, sandwich each of the at least four well layers from both sides, and includes an n-side barrier layer connected to the n-type semiconductor layer, a p-side barrier layer connected to the p-type semiconductor layer at an interface portion with the p-type semiconductor layer, and intermediate barrier layers disposed between the n-side barrier layer and the p-side barrier layer,wherein the confinement layer has a thickness not more than 3-times the thickness of each of the at least four well layers,each of the at least five barrier layers is composed of GaN,only the n-side barrier layer, of the at least five barrier layers, is doped with Si,the intermediate barrier layers and the p-side barrier layer are not doped, andthe p-side barrier layer of the at least five barrier layers has a thickness not less than 2-times the thickness of each of the at least four well layers and not more than 4-times the thickness of each of the at least four well layers.
地址 Aichi JP
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