| 摘要 |
PURPOSE:To reduce a noise caused by a laser beam reflected by a substrate and obtain a semiconductor laser device package with high reliability by a method wherein a semiconductor laser element is attached to the junction surface of the substrate and the part of the surface of the substrate vertically below the semiconductor laser element is so formed as not to have a flat surface perpendicular to the junction surface. CONSTITUTION:The surface of an uneven part 28a formed at the base part of a junction surface 14 on a substrate 10 is inclined so as to become lower from a recessed part 18 toward the junction surface 14. A laser beam emitted from a semiconductor element 16 downward is reflected toward the junction surface 14 by the uneven part 28a. Therefore, the laser beam is not reflected vertically straight upward like a conventional case and an optical system is protected from incidence of the reflected beam. Even if the laser beam enters the optical system by scattering, the laser beam is attenuated by the scattering so that a noise can be suppressed below a certain level.
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