| 摘要 |
PURPOSE:To obtain a laminated article of a polyimide molding of excellent bonding force, by laying a polyimide sheet adhesive on the treated surface of a polyimide molding subjected to specified treatments, laying an adhered on the assemblage and heating the final assemblage under a pressure. CONSTITUTION:A polyimide molding such as a film, a flexible printed wiring board or a laminate is treated with a solution of 0.1-50wt% basic compound (e.g., KOH) in water and/or an alcohol at room temperature to 80 deg.C for 0.1 min-1hr, optionally treated with an acid solution, treated with a solution (e.g., acetone) in which 0.01-30wt% silane coupling agent (e.g., gamma- aminopropyltriethoxysilane) for 0.5-10min and further heat-treated at 80 deg.C or above for 1-60min to obtain a treated polyimide molding (A). A polyamide sheet adhesive (B) of a softening point <=400 deg.C is laid on the treated surface component A, a desired adhered (C) (e.g., copper foil) is laid on the adhesive, and the assemblage is heated to a temperature above the softening point of component B at a pressure of 0.1-100kg/cm<2>. |
