| 摘要 |
PURPOSE:To package an IC chip on an electrode substrate extremely easily by using the IC chip where a conductive elastomer layer is attached to a bonding pad of the IC chip in such a way that the layer is formed to be higher than the surface of the IC chip. CONSTITUTION:An IC chip 1 is aligned with an electrode substrate 6 having an extraction electrode 5 which faces a bonding pad 2 of the chip; the assembly is fixed by using a pressing metal fitting of a springy pressurizing support means 7. By this packaging method, the bonding pad 2 of the IC chip 1 and the extraction electrode 5 of the electrode substrate 6 become electrically conductive; this IC chip can be used perfectly for consumer appliances without a potting process. The conductive elastomer layer is formed collectively on the IC chip; the alignment with the electrode substrate becomes easy; the layer is pressed and held after alignment with the electrode substrate; accordingly, it is easy to package all the terminals easily and by one process even when the number of terminals is increased.
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