EPOXY RESIN MOLDING MATERIAL

摘要

PURPOSE:To obtain the titled molding material with the internal stress sufficiently relaxed and no decrease in moisture resistance, by incorporating a reaction product prepared by bonding a plural of silicone compounds mutually differing in their functional groups by reaction between said functional groups. CONSTITUTION:The objective molding compound can be obtained by incorporating (A) a conventional epoxy resin molding material comprising i) an epoxy resin (pref., of novolak type with ionic impurities eliminated and an epoxy equivalent <=300) and ii) a curing agent (pref., a phenol novolak type resin) with (B) a reaction product prepared by boning a plural of silicone compounds mutually differing in their functional groups (e.g., a compound of formula I with the functional group being epoxy one and a second compound of formula II with the functional group being amino one) by reaction between said functional groups.