| 发明名称 |
ELECTRONIC PACKAGE ASSEMBLY |
| 摘要 |
An electronic package assembly is provided. The electronic package assembly includes a package substrate having a first surface and a second surface opposite thereto. A plurality of conductive pads is disposed on the first surface. A chip is mounted onto the first surface of the package substrate. A circuit board is mounted onto the second surface of the package substrate, and includes an electrical connector. A plurality of electrical contact components is electrically connected to the electrical connector and is in contact with the plurality of conductive pads. |
| 申请公布号 |
US2016302306(A1) |
申请公布日期 |
2016.10.13 |
| 申请号 |
US201514958031 |
申请日期 |
2015.12.03 |
| 申请人 |
VIA Alliance Semiconductor Co., Ltd. |
发明人 |
CHANG Nai-Shung;CHANG Wen-Yuan;TSAI Kuo-Ying |
| 分类号 |
H05K1/11;H05K1/02;H05K1/18 |
主分类号 |
H05K1/11 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. An electronic package assembly, comprising:
a package substrate having a first surface and a second surface opposite thereto, wherein a plurality of conductive pads is disposed on the first surface; a chip mounted onto the first surface of the package substrate; a circuit board mounted onto the second surface of the package substrate, and including an electrical connector; and a plurality of electrical contact components electrically connected to the electrical connector and in contact with the plurality of conductive pads. |
| 地址 |
Shanghai CN |
