| 摘要 |
Provided are: a semiconductor device wherein reliability of a connecting section can be improved, while reducing dimensions; and a method for manufacturing the semiconductor device. An image pickup unit 100 of the present invention is characterized by being provided with: an image pickup element 10, which has a light receiving section 11 formed at a main surface center section, and a plurality of electrode pads 12 formed around the light receiving section 11; a flexible printed board 30 having a plurality of inner leads 32 respectively connected to the electrode pads 12 via bumps 13; and an optical member 20, which seals the light receiving section 11 of the image pickup element 10, and which has an alignment section for the inner leads 32, said alignment section having at least one groove section 21 that is formed in a side surface for the purpose of housing a connecting section that connects the electrode pads 12 and the inner leads 32 to each other. |
