| 摘要 |
PURPOSE:To form an accurate circuit pattern by producing dimensional change and distortion of a base material to the maximum limit in the steps of etching an unnecessary section of forming a circuit from a copper foil and heat treating it, and then performing the steps of transferring, heat treating and etching a desired circuit pattern after the further distortion is not produced. CONSTITUTION:A first etching step of removing by etching a copper foil 2 of an unnecessary section of a predetermined circuit of a copper-extended laminated plate 1 and a second etching step of then forming by etching a desired circuit pattern from the plate 1 are provided. Since a dimensional change is applied to the base material of the plate 1 by the initial etching of the periphery of a substrate, the further dimensional change of the base material is eliminated in the step of etching and heat treating to form the desired circuit pattern. Thus, the circuit pattern can be formed in high positional accuracy. |
