| 摘要 |
A component mounting apparatus (1) of the present invention is provided with: a die component supply device (3) having a fixing member (322) for fixing wafer holding members (36, 37) to a table (321), said wafer holding members holding a die component (D); and a component placing device (5) having a loading nozzle (51), a mounting head (52), and a head drive mechanism (54). The die component supply device also has: a height changing unit (323) for changing the supply height (HD) of the die component by lifting the table; and a supply height determining unit (48) that determines the supply height such that a wafer-side height (HW) is less than a head-side height (HH). Consequently, production efficiency of mounting steps can be improved, while preventing the loading nozzle, the mounting head and the like from interfering with obstacles, such as the fixing member, in accordance with differences among the structures of a plurality of kinds of wafer holding members. |
