发明名称 HEAT SINK FOR HIGH POWER TRANSISTOR
摘要 PURPOSE:To contrive improvement in cooling efficiency by a method wherein good heat-conductive epoxy resin is added between the fins implanted into the groove formed in a metal planar member, which constitutes the main body of a heat sink, in the direction of stream of a cooling medium fluid and the metal planar member. CONSTITUTION:A part of the planar fins 2 protrudingly formed on one surface of the metal planar member 1, which constitutes the main body of a heat sink, is inserted into the groove 4 formed in the direction A of the stream of a cooling medium fluid 3 on the metal planar member 1, and good heat-conductive epoxy resin 5 is added between the inserted fins 2a and the metal planar member 1. Besides, it is advantageous than the inserted fins 2a and the molded fins 2 are arranged alternately with each other. As a result, high cooling effect can be obtained when the heat sink is used at high temperature.
申请公布号 JPH01115146(A) 申请公布日期 1989.05.08
申请号 JP19870271938 申请日期 1987.10.29
申请人 FANUC LTD 发明人 FUJIOKA YOSHIMOTO
分类号 H01L23/36;H01L23/473 主分类号 H01L23/36
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