| 摘要 |
PURPOSE:To prevent any operational mistake in each process from occurring by engraving numerals of symbols on a bonding pad of a semiconductor chip. CONSTITUTION:A bonding pad 2 is usable in varieties of processes such as assessment of characteristics of a wafer process, selection of good or bad products in a wafer test by probing, and wiring in an assembly, etc. Numerals and symbols are engraved on the bonding pad 2. It is hereby made clear with which bonding pad a probe needle is to be brought into contact in the assessment of characteristics being executed in a wafer process and a wafer test be bringing the needle into contact with the bonding pad 2 at a required location. In addition, it is further clarified also in an assembly process, that in which direction die bonding should be done on a chip 1 and how wiring should be done by wire bonding (connection of the bonding pad 2 and a lead gold wire or an aluminum wire). |
