发明名称 MANUFACTURE OF LAMINATED CERAMIC ELECTRONIC PARTS
摘要 <p>PURPOSE:To enable bad influence of solvent to be small and to obtain laminated ceramic electronic parts by producing an electrode-embedded ceramic green sheet on a supporting body with ceramic slurry and by peeling only the supporting body after performing thermal contact bonding to another ceramic green sheet. CONSTITUTION:An electrode-embedded ceramic green sheet 25 is produced on a supporting body by applying ceramic slurry to the supporting body and by drying it. A heated panel 27 which is heated by a heater 26 is placed at the side where no sheet 25 is formed. A base film 21 and a ceramic raw laminated body 22 which are fixed to a base 20 are placed at the side where a sheet 26 is formed. The sheet 25 is thermally contact-bonded to the laminated body 22. The sheet 25 is transferred to the surface of the laminated layer 22 and an electrode-embedded ceramic green sheet 30 consisting of a transferred electrode 28 and a transferred ceramic green sheet 29 are formed. It allows laminated ceramic electronic parts to be obtained.</p>
申请公布号 JPH01226113(A) 申请公布日期 1989.09.08
申请号 JP19880052851 申请日期 1988.03.07
申请人 MATSUSHITA ELECTRIC IND CO LTD 发明人 NAKAO KEIICHI;KATO MASAHIRO;HORIBE YASUTAKA;OKUYAMA HIKOHARU;OKINAKA HIDEYUKI
分类号 H01G4/12;H01C7/10;H01G4/30 主分类号 H01G4/12
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