发明名称 |
MATERIALE FOR ELEKTRONISKE KOMPONENTER OG FREMSTILLING AVKOMPONENTENE. |
摘要 |
The invention relates to a material which has a high thermal conductivity, and a low density and expansion coefficient. It is characterised in that it consists of a composite made up of a matrix and of a metal belonging to the group consisting of pure aluminium, pure magnesium and their alloys and of reinforcing elements in particulate and/or fibrous form which are selected accurately in respect of nature and proportion. This material finds its application especially in electronics for the production of dissipating bottoms, of carriers, of heat drains and of casings for encapsulating hybrid circuits for power microelectronics. |
申请公布号 |
NO893654(D0) |
申请公布日期 |
1989.09.12 |
申请号 |
NO19890003654 |
申请日期 |
1989.09.12 |
申请人 |
PECHINEY RECHERCHE |
发明人 |
DERMARKAR, SALIM;DUMANT, XAVIER;LEBAILLY, MICHEL |
分类号 |
C22C29/00;C22C32/00;C22C49/04;C22C49/06;C22C49/14;H01L23/14;H05K1/05;(IPC1-7):H01L/ |
主分类号 |
C22C29/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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