| 摘要 |
PURPOSE:To easily exfoliate a coating by a method wherein one part of a wiring conductor formed on an insulating substrate is coated with a first resist layer whose exfoliating property is excellent and with a second resist layer composed of an organic material whose acid-resistance and alkali-resistance is excellent and this assembly is immersed in a plating bath in order to layer- bond a plated layer accurately. CONSTITUTION:One part of a wiring conductor 2 formed on an insulating substrate 1 is coated with a coating layer 3 having a two-layer structure by a first resist layer 3a composed of an organic material whose exfoliation property is excellent and by a second resist layer composed of an organic material whose acid-resistance and alkali-resistance is excellent. Then, this insulating substrate 1 is immersed in a plating bath; a plated metal layer 4 is layer-bonded to the outer surface exposed at the wiring conductor 2. Lastly, the coating layer 3 covering one part of the wiring conductor 2 is exfoliated and removed; a circuit substrate is completed. By this setup, the plated metal layer 4 can be layer- bonded accurately and surely; the coating layer 3 can be removed easily. |
