| 摘要 |
PURPOSE:To cope with fine patterns and improve the etching factor by blowing alkali etching liquid of a specific temperature and pH to a surface of a printed wiring board in the state that a printed wiring board is held almost vertically. CONSTITUTION:A copper-coated laminated board 1 is held almost vertically by a hunger having, for example, a chucking member 2a. In this case, the copper-coated laminated board 1 is a double-sided board. Since wiring patterns are formed on the surface of the board, a resist layer is provided along the pattern. When the copper-coated laminated board 1 is etched, several nozzles 3 are disposed on the both side of the copper-coated laminated board 1 and etching liquid is preferably blown horizontally toward the surface of the base. The temperature of the etching liquid used here is 30-40 deg.C and its pH is in the range of 8.0-8.2. |
