发明名称 METHOD OF MAKING POLISHING LAYER FOR CHEMICAL MECHANICAL POLISHING PAD
摘要 A method of forming a chemical mechanical polishing pad polishing layer is provided, including: providing a mold having a base with a negative of a groove pattern; providing a poly side (P) liquid component; providing an iso side (I) liquid component; providing a pressurized gas; providing an axial mixing device; introducing the poly side (P) liquid component, the iso side (I) liquid component and the pressurized gas to the axial mixing device to form a combination; discharging the combination from the axial mixing device at a velocity of 10 to 300 m/sec toward the base; allowing the combination to solidify into a cake; deriving the chemical mechanical polishing pad polishing layer from the cake; wherein the chemical mechanical polishing pad polishing layer has a polishing surface with the groove pattern formed into the polishing surface; and wherein the polishing surface is adapted for polishing a substrate.
申请公布号 US2016375553(A1) 申请公布日期 2016.12.29
申请号 US201514751423 申请日期 2015.06.26
申请人 Rohm and Haas Electronic Materials CMP Holdings, Inc. ;Dow Global Technologies LLC 发明人 Veneziale David Michael;Qian Bainian;Brugarolas Brufau Teresa;Kozhukh Julia;Tong Yuhua;Miller Jeffrey B.;Lugo Diego;Jacob George C.;DeGroot Marty W.;Wank Andrew;Yeh Fengji
分类号 B24D18/00;B24B37/24 主分类号 B24D18/00
代理机构 代理人
主权项 1. A method of forming a chemical mechanical polishing pad polishing layer, comprising: providing a mold having a base, wherein the base has a negative of a groove pattern formed therein; providing a poly side (P) liquid component, comprising at least one of a (P) side polyol, a (P) side polyamine and a (P) side alcohol amine; providing an iso side (I) liquid component, comprising at least one polyfunctional isocyanate; providing a pressurized gas; providing an axial mixing device having an internal cylindrical chamber; wherein the internal cylindrical chamber has a closed end, an open end, an axis of symmetry, at least one (P) side liquid feed port that opens into the internal cylindrical chamber, at least one (I) side liquid feed port that opens into the internal cylindrical chamber, and at least one tangential pressurized gas feed port that opens into the internal cylindrical chamber;wherein the closed end and the open end are perpendicular to the axis of symmetry;wherein the at least one (P) side liquid feed port and the at least one (I) side liquid feed port are arranged along a circumference of the internal cylindrical chamber proximate the closed end;wherein the at least one tangential pressurized gas feed port is arranged along the circumference of the internal cylindrical chamber downstream of the at least one (P) side liquid feed port and the at least one (I) side liquid feed port from the closed end; wherein the poly side (P) liquid component is introduced into the internal cylindrical chamber through the at least one (P) side liquid feed port at a (P) side charge pressure of 6,895 to 27,600 kPa; wherein the iso side (I) liquid component is introduced into the internal cylindrical chamber through the at least one (I) side liquid feed port at an (I) side charge pressure of 6,895 to 27,600 kPa; wherein a combined mass flow rate of the poly side (P) liquid component and the iso side (I) liquid component to the internal cylindrical chamber is 6 to 500 g/s, wherein the poly side (P) liquid component, the iso side (I) liquid component and the pressurized gas are intermixed within the internal cylindrical chamber to form a combination; wherein the pressurized gas is introduced into the internal cylindrical chamber through the at least one tangential pressurized gas feed port with a supply pressure of 150 to 1,500 kPa; wherein an inlet velocity into the internal cylindrical chamber of the pressurized gas is 90 to 600 m/s; discharging the combination from the open end of the internal cylindrical chamber toward the base at a velocity of 10 to 300 m/sec; allowing the combination to solidify into a cake; separating the cake from the mold; and, deriving the chemical mechanical polishing pad polishing layer from the cake, wherein the chemical mechanical polishing pad polishing layer has a polishing surface with the groove pattern formed into the polishing surface, and wherein the polishing surface is adapted for polishing a substrate.
地址 Newark DE US