| 摘要 |
PURPOSE:To prevent the occurrence of cracks in a hole boring process and the corrosion of a circuit caused by penetration of a plating solution into the cracks and improve a board in an acid resistance so as to improve the board in reliability by a method wherein an interconnection board is formed into one piece in such a manner that outer layer materials are provided to the upside and underside of an inner layer material interposing resin impregnated base material between the outer materials and the upside and underside of the inner layer material respectively, a hole is bored specifying the cure degree of the resin after the board is formed into one piece, and then the resin is made to cure completely. CONSTITUTION:Circuits 2 formed of a metal foil of copper or the like are provided to the upside and underside of an inner layer material 1, and resin impregnated base materials 3 are provided to the upside and underside of the inner layer material 1 provided with the circuits 2. In this process, the cure degree of a resin 5 of epoxy resin or the like infiltrated into a base material 4 formed of such as glass cloth or the like is made to be 85-90% after those material are formed into one piece. Then, a hole boring process is performed, and a curing treatment is executed to make the resin cure completely. By these processes, the separation of the circuit 2 section of the inner layer material 1 and the resin impregnated base material 3 and the occurrence of cracks can be prevented and concurrently the corrosion of the circuits 2 due to penetration of a planting solution can be also restrained. |
