| 发明名称 |
MAGNETIC INTERMETALLIC COMPOUND INTERCONNECT |
| 摘要 |
The present disclosure relates to the field of fabricating microelectronic packages, wherein magnetic particles distributed within a solder paste may be used to form a magnetic intermetallic compound interconnect. The intermetallic compound interconnect may be exposed to a magnetic field, which can heat a solder material to a reflow temperature for attachment of microelectronic components comprising the microelectronic packages. |
| 申请公布号 |
US2016379951(A9) |
申请公布日期 |
2016.12.29 |
| 申请号 |
US201414566185 |
申请日期 |
2014.12.10 |
| 申请人 |
Intel Corporation |
发明人 |
SWAMINATHAN RAJASEKARAN;MAHAJAN RAVINDRANATH V. |
| 分类号 |
H01L23/00 |
主分类号 |
H01L23/00 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A microelectronic interconnection, comprising:
a first metallic attachment structure; a magnetic composite material adjacent the first metallic attachment structure; and a solder material adjacent the magnetic composite material. |
| 地址 |
Santa Clara CA US |
