| 摘要 |
PURPOSE:To improve bonding strength and prevent side slipping of a wire by forming a polycrystalline silicon layer in a single layer or a plurality of layers within an insulation layer for making the surface of a bonding pad to be in recessed and projecting shape. CONSTITUTION:An insulation layer 2 is laminated on a silicon substrate 1 and a bonding pad 3 is formed on this insulation layer 2. Then, a polycrystalline silicon layer 7 is formed in single layer or a plurality of layers within this insulation layer 2 to make the surface of the bonding pad 3 to be in recessed and projecting shape. Thus, since the side surface area of this recessed and projecting surface can be utilized as a contact surface on bonding, the contact area increases in general as compared with before. It increases bonding strength and prevents side slipping of a wire during bonding operation due to recessed and projecting surface. |
