| 摘要 |
PURPOSE:To obtain an IC card generating no positional shift by a method wherein electronic parts are placed on the slit like suction grooves provided on a mold at predetermined positions and, thereafter, a card base material composed of a thermoplastic resin is subjected to injection molding to be inte grated with said parts. CONSTITUTION:Slit like suction grooves 2 each having a width of 0.05-3.0mm are provided to a mold 1 and electronic parts 3 to be received in an IC card are arranged to the mold 1 so as to cover the slit like suction grooves 2 and, thereafter, air is discharged from the slit like suction grooves 2 to fix the electronic parts 3 in the mold 1 at predetermined positions. Subsequently, the mold 1 is clamped and a thermoplastic resin becoming a card base material 4 is subjected to injection molding and, after the resin is cooled and solidified, the resin molded body is taken out of the mold 1 and, if necessary, a decorative laminate film 5 is bonded to the front and rear surfaces of the resin molded body to obtain an IC card. Therefore, the IC card generating no positional shift of the electronic parts and having excellent airtightness and high reliability is obtained by an easy process. |
