| 摘要 |
<p>PURPOSE:To make it possible to image an emission from a light-emitting diode on a photo-sensitive body very efficiently by a construction wherein an optical fiber bundle which pierces through a substrate and one end of which is exposed on the lower side is buried just below each LED. CONSTITUTION:A metal wiring 22 formed on the surface of a substrate 21, a bump electrode 29 of an LED array chip 23 and a bump electrode 30 of IC 27 are connected together, and a slit 24 having an opening in a part opposite to LED 31 is formed in the surface of the substrate 21. Moreover, a fiber bundle 25 is disposed in the part of the substrate 21 corresponding to the LED, while a microlens array 26 is bonded, corresponding to each LED 31, on the surface opposite to the surface whereon the LED array chip 23 is mounted. A light emitted from the LED 31 passes through transparent resin 33, while the light other than said light is intercepted by the slit 24. Thus, only the light of each LED 31 is passed through the fiber bundle 25, focused by the microlens array 26 and imaged on the surface of a photosensitive body 28.</p> |
