| 摘要 |
PURPOSE:To obtain a hybrid integrated circuit characterized by excellent withstand voltage and adhesive strength by using a ceramic substrate on the main surface of which a copper plate is directly bonded, and avoiding the formation of voids. CONSTITUTION:A copper plate 12 is formed by heat treatment in, e.g., nitrogen atmosphere, after a copper material is mounted on a ceramic substrate 11. A wiring layer 14 is formed on the copper plate 12 through an insulating layer 13. At this time, the insulating layer 13 is formed by printing, e.g., ZnO-based glass-powder insulating paste, by a screen printing method, and thereafter baking the paste in the nitrogen atmosphere. Gas due to an organic vehicle in the copper thick layer, solvent and the like is not generated. Voids are not formed at the interface between the copper plate 12 and the insulating layer 13 or in the insulating layer. Thus excellent withstand voltage and adhesive strength can be obtained. |
