| 摘要 |
PURPOSE:To ensure that high-reliability and high-durability bonding processing is easily performed by aligning to the same height, bonding connection points at the both ends of bonding wire used for connecting the first insulation substrate with thermal resistors to the second insulation substrate without thermal resistors. CONSTITUTION:A connection substrate 2 is mounted on the stepped surface of a fixing member 6A and a heat-generation substrate 1A is mounted on the top of the fixing member 6A. At that time, the thickness of the heat-generation substrate equals the height of the upper step on the connection substrate and the height of the upper step on the fixing member equals the height of the lower step on the connection substrate. Thus the upper surfaces of the both substrates 1A, 2 are aligned on the same plane and the stepped surface 2m of the connection substrate 2 comes in close contact with the bottom of the heat-generation substrate 1A. When bonding connection is performed using wire, the bonding connection points at the both ends of the wire 5 are almost the same height, because the upper surfaces of the both substrates are aligned. In addition, bonding connection is automatically controlled with ease and highly reliable connection is ensured. |
