| 摘要 |
PURPOSE:To produce a high-density multi-wiring board provided with insulated fine electrical wires having an extremely low risk of disconnection by providing insulated electrical wires consisting of metallic lines coated with an alkali-resistant insulating layer and an adhesive resin layer, forming a resist film having a peelable metallic layer and then forming a through hole. CONSTITUTION:After an adhesive layer 3 is provided on an insulating substrate 1, there are arranged insulated electrical wires consisting of metallic lines 8 coated with an alkali-resistant insulating layer 11 and an adhesive resin layer 10. A resin composition 5 is deposited thereon and a peelable resist coat film 13 is formed. Further, a resist film having a peelable metallic layer 14 is formed thereon and a through hole 6 is formed in the structure. The structure is treated with plasma and the resist- film having the metallic layer is peeled off. The inner wall of the through hole is coated with a metallic coat film and the resist coat film is peeled off. Since the used insulated electrical wires have the thick insulating layer having high alkali resistance and the adhesive resin layer also having high alkali resistance, risks of causing disconnection in the wires can be decreased substantially during the wiring operation. Further, the resist film having the metallic layer can protect the resist coat film consisting of a thermoplastic resin during the plasma treatment for smear removal. |
